17–19 nov 2026
Area Territoriale della Ricerca di Bologna
Europe/Rome timezone

Sustainable Alumina/Silk Fibroin Hybrid Dielectric Enabled by Low-Temperature Atomic Layer Deposition for Flexible Organic Electronics

18 nov 2026, 14:30
15m
Centro Congressi (Area Territoriale della Ricerca di Bologna)

Centro Congressi

Area Territoriale della Ricerca di Bologna

Via Piero Gobetti 101
DISPOSITIVI AVANZATI Contributi Scientifici

Speaker

LORENZO SASSI (CNR ISMN Bologna)

Descrizione

Sustainable organic electronics requires low thermal budget processing together with bio-derived functional materials. We report a hybrid dielectric platform combining low-temperature (80 °C) atomic layer deposited Al₂O₃ with silk fibroin, a naturally derived protein, for low-voltage organic field-effect transistors on flexible PEN substrates. We compare ultrathin silk fibroin interfacial layers with conventional PMMA as a benchmark, and discuss the correlation between interface engineering, semiconductor morphology and device characteristics under flat and bent conditions. Attention is given to the continuity of the fibroin films on low-temperature ALD oxide, to the resulting low-voltage operation, leakage, mobility and bending stability down to 5 mm radius, and to the absence of any post-deposition annealing requirement for as-cast fibroin. The demonstrated compatibility with thermally sensitive flexible substrates indicates a route toward bio-based and eco-compatible substrate technologies for sustainable organic electronics.

Giovane Ricercatore (under 40) Yes

Primary author

LORENZO SASSI (CNR ISMN Bologna)

Coautore

Marco Natali (Istituto per lo Studio dei Materiali Nanostrutturati Consiglio Nazionale delle Ricerche Unita Operative di Supporto di Bologna) Mirko Seri (Istituto per lo Studio dei Materiali Nanostrutturati Consiglio Nazionale delle Ricerche Unita Operative di Supporto di Bologna) CRISTIANO ALBONETTI (ISMN-BO) GIOVANNA SOTGIU TAMARA POSATI MICHELE MUCCINI

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